Business
사업분야
레이저 응용 가공 솔루션 (Technical Solution)
Business Area
Technical Solution
레이저 응용 가공 솔루션
다양한 산업 분야에 맞춘 레이저 마킹, 절단, 식각 등 맞춤형 가공 솔루션을 제공합니다.
- Laser Solution 개발 & 지원
- 광학 시스템 설계 & 개발
- Laser Application
: Cutting, Marking, Drilling, Ablation, Patterning, Welding, Annealing,
Scribing, De-flash, Soldering
Section 1
Semiconductor
반도체 산업
- SIP PKG Cutting
- PKG EMC Drilling
- Solder Soldering
- EMC Marking
- Etc
Section 2
Automobile
자동차 산업
- Patterning
- Metal Marking
- Battery Welding
- Inner Glass Marking
- Etc
Section 3
Mobile Phone
휴대폰 산업
- Touch Screen Panel Cutting, Patterning
- Bettery Marking, Welding
- PCB & FPCB Cutting, Marking
- Camera Module Cutting, Marking
- Fingerprint Sensor Cutting
- DRAM/Flash Memory Drilling, Marking, Cutting
- Etc
Section 4
SMT
SMT 산업
- Device & Wire Soldering
- Barcode Text Marking
- PCB Cutting
- Etc
Section 5
Metal
금속 가공
- Metal Welding
- Metal Grooving
- Metal Barcode Marking
- Etc
Section 6
ETC
기타 가공
- Plastic Marking
- Glass Cutting, Marking
- Box Marking
- Mask Marking
- Etc
